View TEA6200_499033.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TEA6200 Integrated AM upconversion receiver
Product specification File under Integrated Circuits, IC01 August 1989
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
GENERAL DESCRIPTION
TEA6200
The TEA6200 is an integrated AM upconversion receiver circuit with an IF of 10.7 MHz. Because of the high dynamic range of the RF prestage there is no tuned prestage. The whole selectivity is provided by crystal filters. The circuit is intended for use in AM radios with synthesizer tuning. The TEA6200 can handle RF signals up to 2 V RMS. Features * No pre-tuned selection is required * No LW/MW switching * RF input is protected from static discharge from the aerial * Electronic standby switch * Voltage controlled oscillator for synthesizer tuning * IF output providing level information for search tuning. * No alignment required. QUICK REFERENCE DATA PARAMETER Supply voltage range Supply current range AF output voltage with: RF at 1 MHz and 10 mV fm at 400 Hz and 30% AGC start AGC range Vaf Vrf Vrf - 30 - 350 50 95 - 80 - mV V dB SYMBOL VP IP 7.6 - MIN. 8.5 50 TYP. 9.4 70 MAX. V mA UNIT
PACKAGE OUTLINE 20-lead dual in line; plastic (SOT146); SOT146-1; 1996 August 02.
August 1989
2
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
TEA6200
Fig.1 Block diagram.
August 1989
3
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
PINNING 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 SWD MXI MXO1 MXO2 VP LVO AGC Vref OSC n.c. IFO AFO DTI STB IFI1 IFI2 GND SPO PRI PRO switching delay mixer input mixer output 1 mixer output 2 supply voltage level output AGC time constant reference voltage oscillator not internally connected* IF output AF output detector input standby switch IF input 1 IF input 2 ground switched prestage output prestage input prestage output Fig.2 Pinning diagram.
TEA6200
* Pin 10 must be connected to pin 5, 8 or 17.
August 1989
4
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage Supply current Total power dissipation Operating ambient temperature range Storage temperature range Electrostatic discharge voltage IP Ptot Tamb Tstg Ves SYMBOL VP - - - -30 -40 - MIN. 12 70 850 + 85 + 150 10 MAX.
TEA6200
UNIT V mA mW C C kV
THERMAL RESISTANCE From junction to ambient Rth j-a = 80 K/W
Will tolerate discharge between -10 kV and +10 kV.
Fig.3 Test circuit in accordance with IEC 315-1 clause 25.
August 1989
5
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
TEA6200
DC CHARACTERISTICS VP = 8.5 V; V14 = VP; Signal in OFF condition; all voltages referenced to ground unless otherwise specified. PARAMETER Mixer input Mixer output 1 Mixer output 2 Level output AGC voltage Reference voltage Oscillator DC voltage Prestage input Prestage output CONDITIONS SYMBOL VI VO VO VO VAGC Vref VOSC VI VO - - - - - - - - - MIN. TYP. 4.0 8.5 8.5 8.5 0.65 4.0 4.0 1.2 3.2 - - - - - - - - - MAX. V V V V V V V V V UNIT
CHARACTERISTICS VP = 8.5 V; Tamb = 25 C; fRF = 1 MHz at 10 mV RMS; QOSC = 50; modulation = 400 Hz at 30%; insertion loss of filters: crystal filter = 1 dB; ceramic filter = 4 dB, all voltages referenced to ground unless otherwise specified. PARAMETER Supply Supply voltage range Supply current range Guaranteed operating voltage Standby switch ON voltage OFF voltage ON current OFF current Supply current Prestage Switching threshold Hysteresis Oscillator Frequency range Oscillator amplitude Tuned circuit selectivity Mixer Input capacitance Input impedance Conversion transconductance C2-8 Z2-8 I3-4/V2-8 - 10 - 5 40 3.8 10 - - pF k S fosc Vosc QOSC 10.8 200 20 - 420 50 17.8 - - MHz mV - device OFF note 1 modulation = 80% Vrf Vrf - 1.5 320 3.5 - 5.5 mV dB V14 V14 |I14| -I14 IP 3.2 0 - - - - - - - - VP 1 10 0.5 10 V V A mA mA VP IP VP 7.6 - 7.0 8.5 50 - 9.4 70 10.0 V mA V CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
August 1989
6
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
TEA6200
PARAMETER IF amplifier Input impedance Input capacitance Output impedance Detector Input impedance Output impedance Output level Reference voltage Voltage Output impedance Ripple rejection
CONDITIONS
SYMBOL
MIN. - -
TYP. - 5
MAX.
UNIT
R16-15 C16-15 Z11 note 2 Z13 Z12 Vaf VP = 8.5 V V8 Z8 V P ---------V 8 see Fig.5 Z6 Vrf = 70 V Vrf = 2 mV (S + N)/N = 6 dB (S + N)/N = 26 dB (S + N)/N = 46 dB RF = 150 kHz (S + N)/N = 26 dB Vrf Vaf Vaf dtot (S + N)/N V6 V6 Vrf Vrf Vrf
10 - 230
k pF k mV
330
430
265 7 250
380 10 350
500 14 500
3.8 - 40
4.0 20 -
4.2 - -
V dB
Level output pin 6 Output impedance Output voltage Output voltage RF sensitivity RF input
- 0.5 - - - - -
1 0.7 15
- 1.0 -
k mV mV V V V V
11 110 1100 200
20 150 2000 -
Output signal AF output voltage Total distortion Signal plus noise-to-noise ratio Ripple rejection Vrf = 10 mV Vrf = 20 V Vrf = 1 mV; modulation = 80% RF = 10 mV to 1 V VP = 8.5 V + Vr 20 Hz < fR < 20 kHz Vrms = 40 mV V P ----------V af 20 - - dB - 53 3 57 5 - % dB 250 - 350 100 500 - mV mV
August 1989
7
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
TEA6200
PARAMETER Large signal handling Aerial input voltage AGC range of preamplifier switch Switching threshold Hysteresis
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
THD = 10%; modulation = 80% Vrf 2 - modulation = 80% modulation = 80% Vrf Vrf V P -----------V 20 - 1.5 - 3 12 320 3.5 40 - - - 5.5 - V dB mV dB dB
Ripple rejection of preamplifier 20 Hz < fR < 1.5 MHz AGC AGC range Change of Vaf AGC start Intermodulation free dynamic range Long wave second order third order Medium wave second order third order 350/250 kHz input noise level = -99 dBm input noise level = -99 dBm 650/1550 kHz input noise level = -104 dBm 1.25/1.4 MHz input noise level = -104 dBm Notes to the characteristics 100 V < Vrf < 2 V Vrf
- - 30
95 2 50
- 3 80
dB dB V
I MFDR 2 I MFDR 3
72 -
82 86
- -
dB dB
I MFDR 2
74
84
-
dB
I MFDR 3
-
90
-
dB
1. The prestage is connected to the aerial by a 6 MHz low-pass filter that decouples unwanted aerial cable resonance frequencies. The large dynamic range of the prestage is achieved by use of a transimpedance amplifier with a feedback loop consisting of an equivalent aerial capacitance and a feedback capacitor. When large RF signals are received the feedback capacitance in the loop is increased and the gain subsequently reduced, (see Fig.4). C ae G V = V rf x --------Voltage gain for small signals C1 Voltage gain for large signals C ae G V = V rf x ------------------C1 + C2
2. To protect the demodulator and the AGC circuitry, against parasitic oscillation in the IF section, a ceramic filter is connected between the IF output and detector input.
August 1989
8
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
TEA6200
Fig.4 Prestage circuit.
Fig.5 IF output level.
August 1989
9
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
TEA6200
Fig.6 Signal plus noise-to-noise ratio.
Fig.7 Total harmonic distortion.
APPLICATION INFORMATION Notes Fig. 8. COMPONENT (1) (2) (3) (4) (5) Crystal filters Ceramic filter Transformer Variable capacitance diode. Oscillator coil CIRCUIT IDENTITY XTAL SFE T1 D1 L1 SUPPLIER REFERENCE NDK 10T 7 BA Murata E 10 7 S Toko 7PS-1078 JK BB609, BB809 or BBY40 Toko 7PS-1077 X
August 1989
10
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... August 1989 11 Product specification Philips Semiconductors APPLICATION INFORMATION
Integrated AM upconversion receiver TEA6200
Fig.8 Application diagram.
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
PACKAGE OUTLINE DIP20: plastic dual in-line package; 20 leads (300 mil)
TEA6200
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
August 1989
12
Philips Semiconductors
Product specification
Integrated AM upconversion receiver
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TEA6200
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
August 1989
13

▲Up To Search▲

Price & Availability of TEA6200

	To Download TEA6200 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .